Research Status of Laser Cutting Technology
DOI:
https://doi.org/10.63313/FE.2007Keywords:
Cutting Technology, Traditional Cutting, New-Type Laser-CuttingAbstract
With the highly advanced development, high performanceof integrated circuit manufacturing, and rapid advancement of optoel-ectronic technology, hard and brittle transparent materials such as s-ilicon wafers and quartz glass have been widely used in fields incl-uding integrated circuits, micro-electromechanical systems, and aero-space, thanks to their excellent physicochemical properties. The dici-ng quality of silicon wafers plays a decisive role in the final produ-ct quality and economic benefits; similarly, quartz glass also requir-es high-quality dicing to prevent stress from propagating along the defective parts of the glass edges and thus causing cracking.This st-udy investigated the current status of dicing from three aspects:tradi-tional dicing, assisted dicing, and dicing after spatial light modulati-on (SLM). Meanwhile, the factors influencing dicing were studiedfr-om the perspectives of laser types, laser polarization states, process-ing parameters, and processing technologies.
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