Heterogeneous Integration System Design for Domain Controller Chips in Autonomous Vehicles: Mechanical-Electronic-Computing Co-Optimization

BoHan Ke

doi:10.63313/AJET.2003

Authors

BoHan Ke University of Bristol, Beacon House, Queens RoadBristol, BS8 1QUUnited Kingdom Author

DOI:

https://doi.org/10.63313/AJET.2003

Keywords:

Heterogeneous Integration, Domain Controllers, Autonomous Vehicles, Co-design, System-in-Package, Thermal Management

Abstract

Autonomous vehicles (AVs) demand increasingly sophisticated domain controllers (DCs) capable of processing immense sensor data and executing complex algorithms in real-time. Traditional monolithic designs are proving insufficient, necessitating the adoption of heterogeneous integration (HI) to combine diverse semiconductor dies and components within a single package. This research addresses the critical challenge of co-optimizing HI system design for AV DCs across mechanical, electronic, and computing domains, a holistic approach currently lacking in siloed design methodologies. The study investigates the trade-offs inherent in various HI architectures, including 2.5D, 3D stacking, and chiplet-based designs, to determine their suitability for AV DC applications. Novel methodologies are developed for concurrently optimizing mechanical aspects, such as thermal dissipation and structural integrity, with electronic design considerations, including power delivery networks and signal integrity. Furthermore, the research explores how AV-specific computing workloads influence HI requirements, informing the development of a unified co-design framework. This framework integrates mechanical, electronic, and computing considerations from the initial design stages, enabling proactive mitigation of interdependencies and maximization of system-level benefits. Simulation-based validation demonstrates significant improvements in performance, power efficiency, and thermal management compared to non-co-optimized designs. The findings provide crucial design guidelines and a deeper understanding of the interplay between mechanical robustness, electronic integrity, and computing capabilities for next-generation AV DCs.

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